====== Simulation and Test ======
[[ ddsf:public:applications:start | Return to Applications ]]
There is an increasing demand to make Modeling & Simulation and Test environments
more realistic and sophisticated. [[ddsf:public:guidebook:06_append:glossary:d:data_distribution_service_dds]] provides the high [[ddsf:public:guidebook:06_append:glossary:t:thruput|throughput]], low [[ddsf:public:guidebook:06_append:glossary:l:latency|latency]],
real-time data connectivity that is needed to support an increasingly varied and
wide range of complex scenarios. DDS enables [[ddsf:public:guidebook:06_append:glossary:r:reusability|reusability]] and [[ddsf:public:guidebook:06_append:glossary:i:interoperability|interoperability]]
between models and simulators in Live Virtual Constructive simulation.
| Create a Case Study **WWW WWW...** (e.g., My NASA Project ) -> | {{NEWPAGE>ddsf:public:applications:simulation_and_test#pagetemplates:casestudy }} |
===== Hardware-in-the-Loop (HWIL) =====
[[ ddsf:public:applications:start | Return to Applications ]]
* **Please Review**
**Hardware-in-the-loop** (HWIL) simulation is a type of real-time simulation. You use HWIL simulation to test your controller design. HWIL simulation shows how your controller responds, in real time, to realistic virtual stimuli. In HWIL simulation, you use a real-time computer as a virtual representation of your plant model and a real version of your controller.
{{ https://www.mathworks.com/help/physmod/simscape/ug/rt_hil_definition.png?700 |}}
The figure shows a typical HWIL simulation setup.
====== Teledyne, Brown Engineering ====
[[ ddsf:public:applications:start | Return to Applications ]]
Hardware-in-the-loop (HWIL) Modeling and Simulation Framework for Missile Defense
Applications [[ddsf:public:guidebook:06_append:glossary:d:data_distribution_service_dds]] is providing reliable, highly scalable, real-time data
sharing for the [[ddsf:public:guidebook:06_append:glossary:d:dod| U.S. Department of Defense (DoD)]] [[ddsf:public:guidebook:06_append:glossary:m:mda]]
[[ddsf:public:guidebook:06_append:glossary:o:osf]] which is being developed by
Teledyne Brown Engineering.
Source: [[http://ist.adlinktech.com/about-us/our-clients/teledyne-brown-engineering| Broken Link ]]
==== Audi ====
[[ ddsf:public:applications:start | Return to Applications ]]
Your car is probably the most compute-intensive thing that you own. It will have at least
40-50 Electronic Control Units (ECUs) for a recent economy vehicle and well over 100
for a top of the range car. In the past, each of these ECUs had one dedicated function
to perform. This evolved over time and most of the ECUs now perform more than only one
single function or group of functions. Despite this evolution of ECU use, there is still
an increasing need to reduce the number of ECUs and the cabling between them with the
ultimate aim of increasing fuel economy and reducing CO2 emission, whilst providing the
customer even greater functionality in the car. These additional demands are being met
by a shift towards functional integration and communication between ECUs and between
the car and its environment. This is one of many more reasons why the future of
automotive test is becoming distributed and interconnected. Furthermore our test
systems have to evolve as fast as the car functionality to encompass this change.
To address these challenges Audi founded a pre-development department for test
systems, which currently develops a real-time capable bus system based on [[ddsf:public:guidebook:06_append:05_vendors:rti]]
DDS for the future test systems.
Source: [[https://www.rti.com/blog/2015/02/02/the-future-of-automotive/ | RTI: The Future of Automotive ]]
===== Training and Simulation =====
[[ ddsf:public:applications:start | Return to Applications ]]
The aim of simulation is to produce
and control animated images, sound
reproduction, and device feedback
in a manner as realistic and responsive as
the real world, and chasing this ideal has
constantly pushed the industry forward in
many different ways. Individual simulators
have adopted techniques such as multi-[[ddsf:public:guidebook:06_append:glossary:p:processor|processor]] systems, high [[ddsf:public:guidebook:06_append:glossary:p:performance|performance]] graphics
cards and distributed sensors and actuators
to approach the desired [[ddsf:public:guidebook:06_append:glossary:o:objective|objective]].
Source: [[https://cdn2.hubspot.net/hubfs/1754418/RTI_Oct2016/PDF/RTI_Simulation.pdf | Simulator design using
open standards ]]
===== Simulation Technologies =====
[[ ddsf:public:applications:start | Return to Applications ]]
===== NASA =====
[[ ddsf:public:applications:start | Return to Applications ]]
NASA is developing the concepts related to holodeck
simulation systems using today’s technologies and is
investigating the benefits that it could provide to
tele-presence, mission planning, and training activities.
As part of the project, NASA required a DDS [[ddsf:public:guidebook:06_append:glossary:m:midware|middleware]]
solution that allowed real-time, scalable and robust
information exchange between different parts of the system.
Source: [[https://www.rti.com/industries/aerospace-defense | RTI: Modular Open Systems Approach for Affordability ]]
===== Korean Combat Training Center =====
[[ ddsf:public:applications:start | Return to Applications ]]
Simulation settings require real time data distribution, communication, and
analysis. CoreDX DDS provides all this and more:
; Dynamic Discovery
: Adding new systems is easy with CoreDX DDS. CoreDX DDS Dynamic Types allows the run time creation and determination of [[ddsf:public:guidebook:06_append:glossary:d:data_distribution_service_dds]] topics and data types. This technology eases integration challenges, enables flexible bridging between disparate systems, and reduces static memory usage.
; Low latency
: DDS provides exceptionally low [[ddsf:public:guidebook:06_append:glossary:l:latency|latency]] and sustained high throughput numbers across all supported hardware architectures.
; High Reliability
: Systems that use DDS to communicate can do so independent of a [[ddsf:public:guidebook:06_append:glossary:s:server|server]] or service, and independently of each other. They do not rely on each other’s systems to send and process information. A [[ddsf:public:guidebook:06_append:glossary:p:publisher|publisher]] can still publish information even if there is no [[ddsf:public:guidebook:06_append:glossary:s:subscriber|subscriber]] seeking the information, or if a subscriber becomes “lost” for any reason. A subscriber can search for other publishers if the publisher it is getting information from fails or is lost.
Source: [[http://www.twinoakscomputing.com/coredx/industries | Twin Oaks COmputing: Simulation]]
===== Test and Measurement =====
[[ ddsf:public:applications:start | Return to Applications ]]
Test and Measurement focuses on dedicated equipment for analysis, [[ddsf:public:guidebook:06_append:glossary:v:validation|validation]],
and [[ddsf:public:guidebook:06_append:glossary:v:vendorlockin|verification]] of electronic device measurement, mechanical systems, and end
products. As complexity of measurement tasks increases, providers are required
to develop innovative products with higher accuracy and resolution and flexible
system expandability to keep up with technological progress.
Common Test and Measurement Applications:
* Aerospace and Defense
* Automotive Electronics
* Electronic Function
* Radar and Broadband Signal Capture
* Research and Development
Benchtop instruments are conventionally employed in the test and measurement
industry. Modular instrumentation (PXI platform, Digitizers/Oscilloscope), as
an open architecture can, however, provide enormous benefits of compact footprint,
high density, high throughput, and flexibility, enabling configuration of design
verification systems based on different testing requirements. For long-term
investment, the PXI platform simplifies upgrades and conserves long-term cost
of ownership, easily satisfying challenges in the field.
High System Throughput
The PXI PC-based solution provides advantages of the latest high performance
processors, reducing post-processing time. The PXIe backplane bus utilizes the
PC industry's PCI Express® Gen2 technology, greatly increasing throughput and
reducing [[ddsf:public:guidebook:06_append:glossary:l:latency|latency]]. This technology helps transfer data between modules and
controller at higher speeds, reducing test time especially for data and
transaction intensive test applications.
Flexibility and [[ddsf:public:guidebook:06_append:glossary:s:scalable|Scalability]]
PXI is an open standard defined by the PXI Systems Alliance, ensuring that
modules from different vendors can be used together. In addition, by
integrating the bus into the backplane of the chassis, it is possible to
continuously scale systems, with PXI trigger & synchronization function,
enabling simultaneous precision multi-channel sampling.
Smaller Footprint
Aside from taking advantage of Moore's Law of integration and
miniaturization, removal of redundant functions in an integrated
system takes precedence. PXI removes redundancy and can save up
to 80% of the space of traditional systems, expanding flexibility
of function and minimizing upgrade complexity and cost.
Source: [[ https://www.adlinktech.com/en/Test_Measurement-Overview.aspx | Adlink: Test And Measurement ]]
/**=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-
/* To add a discussion page to this page, comment out the line that says
~~DISCUSSION:off~~
*/
~~DISCUSSION:on|Outstanding Issues~~
~~DISCUSSION:off~~