dido:public:ra:xapend:xapend.b_stds:tech:iso:7816-1
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dido:public:ra:xapend:xapend.b_stds:tech:iso:7816-1 [2021/06/26 13:45] nick |
dido:public:ra:xapend:xapend.b_stds:tech:iso:7816-1 [2021/08/06 17:23] (current) murphy [Scope] |
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| ===== ISO/IEC 7816-01 Identification cards — Integrated circuit cards — Part 1: Cards with contacts — Physical characteristics ===== | ===== ISO/IEC 7816-01 Identification cards — Integrated circuit cards — Part 1: Cards with contacts — Physical characteristics ===== | ||
| - | [[dido:public:ra:xapend:xapend.b_stds:tech:iso| return to the ISO Standards ]] | + | [[dido:public:ra:xapend:xapend.b_stds:tech:iso:start| return to the ISO Standards ]] |
| <table> | <table> | ||
| - | <caption>Data sheet for Identification cards — Integrated circuit cards — Part 1: Cards with contacts — Physical characteristics</caption> | + | <caption>Data sheet for [[dido:public:ra:xapend:xapend.a_glossary:i:identification|Identification]] cards — Integrated circuit cards — Part 1: Cards with contacts — Physical characteristics</caption> |
| | Title | Identification cards — Integrated circuit cards — Part 1: Cards with contacts — Physical characteristics | | | Title | Identification cards — Integrated circuit cards — Part 1: Cards with contacts — Physical characteristics | | ||
| | Acronym | | | | Acronym | | | ||
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| ==== Scope ==== | ==== Scope ==== | ||
| - | This part of ISO/IEC 7816 specifies the physical characteristics of integrated circuit cards with contacts. It applies to identification cards of the ID-1 card type, which can include embossing and/or a magnetic stripe and/or tactile identifier mark as specified in ISO/IEC 7811. Test methods are specified in ISO/IEC 10373-1. | + | This part of ISO/IEC 7816 specifies the physical characteristics of integrated circuit cards with contacts. It applies to identification cards of the ID-1 card type, which can include embossing and/or a magnetic stripe and/or tactile [[dido:public:ra:xapend:xapend.a_glossary:i:id|identifier]] mark as specified in ISO/IEC 7811. Test methods are specified in ISO/IEC 10373-1. |
| - | This part of ISO/IEC 7816 applies to cards that have a physical interface with electrical contacts. It does not, however, define the nature, number, and position of the integrated circuits in the cards. | + | This part of ISO/IEC 7816 applies to cards that have a physical [[dido:public:ra:xapend:xapend.a_glossary:i:interface|interface]] with electrical contacts. It does not, however, define the nature, number, and position of the integrated circuits in the cards. |
| + | /**=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=- | ||
| + | /* To add a discussion page to this page, comment out the line that says | ||
| + | ~~DISCUSSION:off~~ | ||
| + | */ | ||
| + | ~~DISCUSSION:on|Outstanding Issues~~ | ||
| + | ~~DISCUSSION:off~~ | ||
dido/public/ra/xapend/xapend.b_stds/tech/iso/7816-1.1624729542.txt.gz · Last modified: 2021/06/26 13:45 by nick
